The XG6 series utilizes KIOXIAs latest 96-layer, 3D TLC (3-bit-per-cell) flash memory. With 4th generation BiCS FLASH and SLC cache features, XG6 SSDs reach up to sequential read/write speeds of 3180 MB/s and 2960 MB/s respectively and deliver up to 355,000 random read and 365,000 random write IOPS. In addition to high performance, XG6 carries on the low power design of the XG family, consuming 4.7 W or less in active mode and less than 3 mW in stand-by mode.
The new XG6 series is optimized for power-sensitive mobile PCs, performance-oriented gaming PCs, as well as data center environments for server-boot, caching and logging.
Available in a compact M.2 2280 single-sided form factor, the XG6 series comes in three capacity models of 256 GB, 512 GB and 1024 GB, each with the option of a Self-Encrypting Drive (SED) model supporting TCG Opal Version 2.01.
Basic Specifications
Fomatted Capacity
1,024 GB
Connector Type
M.2 M
Interface
PCIe Gen3 x4, NVMe 1.3a
Maximum Interface Speed
32 GT/s
(PCIe Gen3 x4)
Memory Type
TLC (BiCS FLASH)
Sequential Read (Up to)
3,180 MB/s
Sequential Write (Up to)
2,960 MB/s
Reliability
MTTF
1,500,000 hours
Power Requirements
Supply Voltage
3.3 V +/- 5 %
Power consumption (Active)
4.7 W typ.
Power Consumption (L1.2 mode)
3 mW typ.
Environmental
Temperature (Operating)
0 to 95 oC
(Controller Temperature)
0 to 85 oC
( Other Components Temperature )
Temperature (Non-operating)
-40 to 85 oC
Vibration (Operating/Non-operating)
196 m/s2 20 G ( Peak, 10 to 2,000 Hz )
Shock (Operating/Non-operating)
14.7 km/s2 1,500 G ( 0.5 ms )
More features
Sanitize is supported.
Namespace Management and Namespace Attachment commands are supported.
Non-Operational Power State Configuration is supported.
TCG Storage Interface Interactions Specification (SIIS) Version 1.07 is supported.
Item Dimension (L”xW”xH”)
4 x 1 x 1
Weight
1 lb
Warranty Information
5 Years
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