DESCRIPTION
HyperX HX426C16FB3K2/16 is a kit of two 1G x 64-bit (8GB) DDR4-2666 CL16 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 1G x 8-bit FBGA components per module. Each module kit supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0. Total kit capacity is 16GB. Each module has been tested to run at DDR4-2666 at a low latency timing of 16-18-18 at 1.2V. Additional timing parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:
FACTORY TIMING PARAMETERS
• Default (Plug N Play): DDR4-2666 CL16-18-18 @1.2V
• XMP Profile #1: DDR4-2666 CL16-18-18 @1.2V
FEATURES
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP = 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• On-Die termination (ODT)
• 16 internal banks; 4 groups of 4 banks each
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
• Height 1.3425” (34.1mm), w/heatsink
CL(IDD)
16 cycles
Row Cycle Time (tRCmin)
45.75ns(min.)
Refresh to Active/Refresh Command Time (tRFCmin)
350ns(min.)
Row Active Time (tRASmin)
29.25ns(min.)
UL Rating
94 V – 0
Operating Temperature
0oC to +85oC
Storage Temperature
-55oC to +100oC
Item Dimension (L”xW”xH”)
1 x 3 x 7
Weight
1.00 LB
Warranty Information
Lifetime Manufacture Warranty
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